Bisphenols for Flame Retardant Gloves

Bisphenol S epoxy is a new type of epoxy, which has better flexural, compressive strength and thermal stability than traditional bisphenol a epoxy due to the introduction of-SO2-polar group. The glass transition temperature was 40 °c higher than that of epoxy under the same curing conditions. With the rapid expansion of polymer materials, more and more research has been done on epoxy. Rainere, Udog, HeinrichHW and so on synthesized bisphenol s epoxy by two-step method. SYKORAV, Spacek V. J. The low epoxy value of Bisphenol s synthesized by APPL and epoxy affects the application of bisphenol s bonding properties. In view of the above phenomena, the following two methods are available: (1) the BISPHENOL s epoxy is directly synthesized by one-step precipitation method using base as catalyst, and the chemical stability and thermal stability of the epoxy obtained by this method are good, (2) the Phase-transfer catalyst one step synthesis of bisphenol s epoxy has the advantages of simple process, high purity, less impurities and high epoxy value, however, the melting point of tetramethylammonium bromide used in this method is more than 300 °C, so the reaction temperature is very high and the reaction time is prolonged, which affects the working efficiency. Therefore, a method of synthesizing bisphenol s epoxy with high yield, high epoxy value, short reaction time and high working efficiency has been developed.

Using bisphenol s epoxy bisphenol a epoxy as the composite epoxy system, the composite epoxy system was toughened and modified by flexible curing agent, a composite epoxy adhesive with excellent strength and toughness. Using D230 as a flexible curing agent, the composite epoxy adhesive has a relatively high shear strength. The shear strength of the adhesive increased first and then decreased with the increase of Bisphenol s epoxy content or D230 content, and the shear strength of the adhesive was the highest when w (D230) = 40% or w (bisphenol s epoxy) = 30% , and it has the best adhesive effect on glass fiber reinforced plastic. Epoxy can be used as a coating, which has the advantages of good fluidity, low viscosity, non caking, easy storage, and good wettability. Can also be used as insulation and electrical protection parts. For example, 100 parts of BISPHENOL S Epoxy containing n = 0,66 parts of tetrahydrophthalic anhydride, and 0.5 parts of 2,4,6-tris (dimethylaminomethyl) phenol are mixed at 110-130 °C, cooled to form a powder composite, which is then coated on a PE film, no coalescence for 30 days at 25 °C. 4,4-diallyl-2-ethoxylbenzoic acid p-bisphenol s ester and m-chloro-peroxybenzoic acid (MCPBA) were synthesized by oxidation method, the structure of Bisphenol S Benzoate (P-BPSAEB) epoxy liquid crystal compound has been studied.
Bisphenol s cyclic sulfur resin was synthesized from bisphenol s epoxy and KSCN. The characterization method of the conversion of Epoxy Group was established, and the factors influencing the synthesis reaction were studied systematically. The structure of bisphenol s cyclic sulfur resin was characterized by FT-IR and h-n. It was found that bisphenol-s cyclic sulfur resin could self-cure without external curing agent. The Curing Reaction Order n = 0.949. In addition, the BISPHENOL s cyclic sulfur resin can also reduce the activation energy of the general epoxy curing reaction and play an accelerated curing role. In terms of thermal properties, the bisphenol s cyclic sulfur resin can achieve the same effect as the BISPHENOL s epoxy in improving the heat resistance of the resin, so that the initial temperature of thermal decomposition of the epoxy is higher than 300 °C.

BPS，Polymer Materials of Bisphenol S,Raw Material Solid Polycarbonate,Raw material Of Thermal Sensitive Material,Raw Material Of Epoxy Resin,Surfactant For Daily Use,Organic Intermediate Bisphenol S.