Bisphenols for Flame Retardant Yarn Dyed Fabric

Bisphenol S is 4,4’-- Hydroxydiphenyl Sulfone, also known as 4,4’-- DISULFONYL diphenol. BISPHENOL S has excellent heat resistance, light resistance and oxidation resistance. Poly (ether sulfone)(PES) engineering plastics with excellent properties can be prepared by the polymerization of bisphenol s alkali metal salt with dichlorodiphenylsulfone. The Composite Resin of polysulfone and polyethersulfone was synthesized by reaction of polysulfone with Bisphenol A and dichlorodiphenylsulfone. Polycarbonate can be synthesized by the condensation of Bisphenol s with phosgene, or by the condensation of Bisphenol a with phosgene. The BISPHENOL s epoxy cured with bisphenol s has better thermal deformation temperature and thermal stability than Bisphenol a epoxy. It can be used to manufacture high temperature structural adhesives, laminates, molding compounds and powder coatings. BISPHENOL S can also be used to modify bisphenol a epoxy to improve product performance. BISPHENOL S can be used in the preparation of Polyester Resin, Phenol formaldehyde resin, polyethersulfone high temperature anti-wear coatings. Bisphenol s can also be used as an additive in a variety of polymeric resins to improve their properties: polyester resin can be added to increase its impact strength; polyurethane resin can be added as plasticizer; The addition of polyvinyl chloride can increase the resistance to UV aging; the addition of Phenol formaldehyde resin or epoxy can be used as a catalyst to accelerate curing.

BPS，Polymer Materials of Bisphenol S,Raw Material Solid Polycarbonate,Raw material Of Thermal Sensitive Material,Raw Material Of Epoxy Resin,Surfactant For Daily Use,Organic Intermediate Bisphenol S.

Bisphenol s epoxy vinyl resin was synthesized from bisphenol s epoxy and acrylic acid. The molecular structure of bisphenol s epoxy vinyl resin was characterized by FT-IR, lh-n, ESI/MS. Combining with 1h-n, the reaction time control curve of bisphenol s epoxy vinyl resin was established to control the vinyl content in the resin. Combined with DSC and POM characterization, partial crystallization of bisphenol s vinyl resin with 50% vinyl content was found below 92 °C.