Bisphenol s for Various Flame Retardant

Using Bisphenol S epoxy bisphenol a epoxy as the composite epoxy system, the composite epoxy system was toughened and modified by flexible curing agent, a composite epoxy adhesive with excellent strength and toughness. Using D230 as a flexible curing agent, the composite epoxy adhesive has a relatively high shear strength. The shear strength of the adhesive increased first and then decreased with the increase of Bisphenol s epoxy content or D230 content, and the shear strength of the adhesive was the highest when w (D230) = 40% or w (bisphenol s epoxy) = 30% , and it has the best adhesive effect on glass fiber reinforced plastic. Epoxy can be used as a coating, which has the advantages of good fluidity, low viscosity, non caking, easy storage, and good wettability. Can also be used as insulation and electrical protection parts. For example, 100 parts of BISPHENOL S Epoxy containing n = 0,66 parts of tetrahydrophthalic anhydride, and 0.5 parts of 2,4,6-tris (dimethylaminomethyl) phenol are mixed at 110-130 °C, cooled to form a powder composite, which is then coated on a PE film, no coalescence for 30 days at 25 °C. 4,4-diallyl-2-ethoxylbenzoic acid p-bisphenol s ester and m-chloro-peroxybenzoic acid (MCPBA) were synthesized by oxidation method, the structure of Bisphenol S Benzoate (P-BPSAEB) epoxy liquid crystal compound has been studied.
Bisphenol s cyclic sulfur resin was synthesized from bisphenol s epoxy and KSCN. The characterization method of the conversion of Epoxy Group was established, and the factors influencing the synthesis reaction were studied systematically. The structure of bisphenol s cyclic sulfur resin was characterized by FT-IR and h-n. It was found that bisphenol-s cyclic sulfur resin could self-cure without external curing agent. The Curing Reaction Order n = 0.949. In addition, the BISPHENOL s cyclic sulfur resin can also reduce the activation energy of the general epoxy curing reaction and play an accelerated curing role. In terms of thermal properties, the bisphenol s cyclic sulfur resin can achieve the same effect as the BISPHENOL s epoxy in improving the heat resistance of the resin, so that the initial temperature of thermal decomposition of the epoxy is higher than 300 °C.

BPS，Polymer Materials of Bisphenol S,Raw Material Solid Polycarbonate,Raw material Of Thermal Sensitive Material,Raw Material Of Epoxy Resin,Surfactant For Daily Use,Organic Intermediate Bisphenol S.