Home> Products> Purity Of Bisphenol S> Bisphenol S 99.5%> Bottle raw material bisphenol s
Bottle raw material bisphenol s
Bottle raw material bisphenol s
Bottle raw material bisphenol s

Bottle raw material bisphenol s

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Payment Type:L/C,T/T
Incoterm:FOB,CFR,CIF,FAS,FCA
Transportation:Ocean,Land,Air
Port:SHANGHAI
Product Attributes

Model No.99.5%

BrandHONGJIU

Appearancecyrstalline powder

Applicationepoxy resin

Colorwhite

Chemical FormulaC12H10O4S

CAS NO.80-09-1

Purity99.5%

Qualitysuperior

Executive Stardandnational stardand

Packingpacked in bag

Raw Materialphenol

Packaging & Delivery
Selling Units : Ton
Package Type : 25KG/bag, 500KG/bag, 600KG/bag, 700KG/bag. White anti-static bag Four-sided shovel tray Wrapping film
Picture Example :
Bisphenol s 99.5%
Product Description

Bisphenol S is used in food and beverage cans to protect food from direct contact with metals, and in epoxy coatings to prevent the corrosion of metal cans and aluminum boxes by food ingredients. It is commonly used in the packaging of milk powder, meat products, and SURIMI products. Bisphenol s plays two main roles, one is because the epoxy coating is easy to remain hydrochloric acid in the polymerization process, can be neutralized by bisphenol s, the other is because the food in direct contact is mostly acidic, fatty substances, bisphenol s can replace the epoxy coating prior to the reaction of water, acid and other substances in food, thus improving the stability of the coating, but also to avoid contact with metal materials and food corrosion. BISPHENOL S is a colorant in heat-sensitive paper. The European Commission claims that 30% of the heat-sensitive paper goes into the waste paper recycling stream. So many paper products, such as kitchen paper, food cartons (pizza boxes, instant noodles cups, popcorn tubes, etc.) are made from recycled paper. So the recycling of thermal paper made BPS enter the paper recycling system and contaminate the food contact paper products. BISPHENOL S is one of the synthetic monomers of polyethersulfone. polysulfone is an amorphous, thermoplastic resin. Because of its polymer material structure, it has toughness, transparency and very high heat resistance (continuous use temperature up to 180 degrees, instantaneous high temperature up to 220 degrees.) , Light Weight, good mechanical properties, impact fracture resistance, high Chemical Resistance, good hydrolysis stability, microwave permeability, so for high-temperature heating and repeated high-temperature heating in the tableware are increasingly widely used. Examples include baby bottles, airline plates, microwave cookware, non-stick Pan Coatings (pes can be applied individually or in combination with fluoropolymers to make non-stick pans) , hot-water pipe joints, and some appliances that need to be heated (egg cookers, popcorn cookers, coffeemakers, etc.) .

Using bisphenol s epoxy bisphenol a epoxy as the composite epoxy system, the composite epoxy system was toughened and modified by flexible curing agent, a composite epoxy adhesive with excellent strength and toughness. Using D230 as a flexible curing agent, the composite epoxy adhesive has a relatively high shear strength. The shear strength of the adhesive increased first and then decreased with the increase of Bisphenol s epoxy content or D230 content, and the shear strength of the adhesive was the highest when w (D230) = 40% or w (bisphenol s epoxy) = 30% , and it has the best adhesive effect on glass fiber reinforced plastic. Epoxy can be used as a coating, which has the advantages of good fluidity, low viscosity, non caking, easy storage, and good wettability. Can also be used as insulation and electrical protection parts. For example, 100 parts of BISPHENOL S Epoxy containing n = 0,66 parts of tetrahydrophthalic anhydride, and 0.5 parts of 2,4,6-tris (dimethylaminomethyl) phenol are mixed at 110-130 °C, cooled to form a powder composite, which is then coated on a PE film, no coalescence for 30 days at 25 °C. 4,4-diallyl-2-ethoxylbenzoic acid p-bisphenol s ester and m-chloro-peroxybenzoic acid (MCPBA) were synthesized by oxidation method, the structure of Bisphenol S Benzoate (P-BPSAEB) epoxy liquid crystal compound has been studied.
Bisphenol s cyclic sulfur resin was synthesized from bisphenol s epoxy and KSCN. The characterization method of the conversion of Epoxy Group was established, and the factors influencing the synthesis reaction were studied systematically. The structure of bisphenol s cyclic sulfur resin was characterized by FT-IR and h-n. It was found that bisphenol-s cyclic sulfur resin could self-cure without external curing agent. The Curing Reaction Order n = 0.949. In addition, the BISPHENOL s cyclic sulfur resin can also reduce the activation energy of the general epoxy curing reaction and play an accelerated curing role. In terms of thermal properties, the bisphenol s cyclic sulfur resin can achieve the same effect as the BISPHENOL s epoxy in improving the heat resistance of the resin, so that the initial temperature of thermal decomposition of the epoxy is higher than 300 °C.

BPSPolymer Materials of Bisphenol S,Raw Material Solid Polycarbonate,Raw material Of Thermal Sensitive Material,Raw Material Of Epoxy Resin,Surfactant For Daily Use,Organic Intermediate Bisphenol S.



Bisphenol S Cas Number
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